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What innovations and advancements do you think will be leading the wave? As always, we will see larger capacities and faster speeds. Advancements in manufacturing will lower fabrication costs for current technologies allowing access to a wider audience and driving demand for IC chips. However, any real resurgence in demand is likely to be powered by developments in Artificial Intelligence (AI), which requires specialist high-bandwidth memory (HBM) chips which are designed to handle the massive, rapid data flows that AI systems require. Beyond HBM, we can also expect advancements in 3D stacking technologies, which allow for the layering of memory cells vertically, significantly increasing density and speed while reducing the footprint on the motherboard. This stacking technology continues to be a game-changer for the miniaturisation trend in electronics, leading to even smaller and more powerful devices. And finally, what’s on the horizon for Integral? At Integral, we strive to be ahead of the curve, delivering the newest, fastest, and highest- capacity technologies our customers are waiting for. With our well-established market presence and foresight, we have secured a supply of critical components, ready to bring the latest technological advancements to market.
In the next year, we have our eye on introducing higher capacity SD and microSD cards, utilising the speed enhancements that USB 4 and USB 4 version 2 can provide to external storage devices, and developing digital devices that use the latest advancements in DDR and PCIe technologies, like our recently launched M.2 NVMe PCIe Gen5 SSD, the Edge , offering read/write speeds of up to 12,000MB/s and 10,000MB/s respectively.
INTEGRAL EDGE GEN5 M.2 2280 NVME SSD with Heatsink
Our commitment to our customers is unwavering, and we’ll continue to support them with competitive prices and the best stock availability. The market may ebb and flow, but Integral’s dedication to excellence remains steadfast.
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